Manufacturing Process
1. Cleaning: Ultrasonic cleaning of the PCB or LED bracket, followed by drying.
2. Mounting: After applying silver paste to the bottom electrodes of the LED chip (large disc), it is expanded. The expanded chip is placed on a bonding machine, and under a microscope, a bonding pen is used to install each chip individually onto the corresponding pads on the PCB or LED bracket. Sintering is then performed to cure the silver paste.
3. Wire Bonding: Electrodes are connected to the LED chip using aluminum or gold wire bonding machines to serve as leads for current injection. For LEDs directly mounted on the PCB, aluminum wire bonding is generally used. (Gold wire bonding is required for manufacturing white TOP-LEDs.)
4. Encapsulation: Epoxy resin is applied to protect the LED chip and bonding wires. The shape of the cured epoxy resin applied to the PCB is strictly controlled, as it directly affects the brightness of the finished backlight. This process also involves applying phosphor (for white LEDs).
5. Soldering: If the backlight uses SMD-LEDs or other pre-packaged LEDs, the LEDs need to be soldered onto the PCB board before assembly.
6. Film Cutting: Use a punch press to die-cut various diffusion films, reflective films, etc., required for the backlight.
7. Assembly: Manually install the various materials of the backlight in the correct positions according to the drawings.
8. Testing: Check the photoelectric parameters and light uniformity of the backlight.
9. Packaging: Pack the finished product according to requirements and put it into storage.
